Motion Control 더 빠르게, 더 정밀하게.. Micro-Edge Coater Dispenser Substrate: PLPStage: Y-Axis (730mm) X-Axis (980mm) Z-Axis (50mm)Header: Scanner, Vision Micro-Pattern Dispenser Stage: Y-Axis (550mm) X-Axis (740mm) Z-Axis (100mm) T-Axis ( 5° )Header: Dispensor, Vision Wafer to PLP Die 재 배열 System Fan-Out Panel level PackagingSubstrate size: 720mm X 610mm Module: Wafer Stage, Gantry, Picker, Vision, Cam Ejector, Gripper Spin Coater & Heating Dry Application: PR Spin Coater & Hot PlateSubstrate size: (W)200mm X (D)250mm Glass Scribing System Work Size: 1200mm X 1400mm X 1T (0.3~1T) / 600mm X 500mm Straight Cut / R Cut (>0.2mm) since Dec. 24 ‘ 2012