Motion Control

더 빠르게, 더 정밀하게..

Micro-Edge Coater Dispenser

Substrate: PLP

Stage:  Y-Axis (730mm)

           X-Axis (980mm)   

           Z-Axis (50mm)

Header: Scanner,  Vision    

Micro-Pattern Dispenser

Stage:  Y-Axis (550mm)

           X-Axis (740mm)   

           Z-Axis (100mm)

            T-Axis ( 5° )

Header: Dispensor,  Vision 

Wafer to PLP
Die 재 배열 System

Fan-Out Panel level Packaging

Substrate size: 720mm X 610mm 

Module: Wafer Stage, Gantry, Picker, Vision,

                    Cam Ejector, Gripper

Spin Coater & Heating Dry

Application: PR Spin Coater & Hot Plate

Substrate size: (W)200mm X (D)250mm

Glass Scribing System

Work Size:

         1200mm X 1400mm X 1T (0.3~1T) /

          600mm X 500mm

          Straight Cut / R Cut (>0.2mm)

since Dec. 24 ‘ 2012