Spike™ Tab Heating System

Solar - Inline Tabbing System

  • Application: Wire Type PV Tabbing Process 
  • Process Temp: 0 ~ 250℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp <± 5℃ / Soak <± 3℃
  • Temp Read: Pyrometer(8~14µ) & Embbeded T/C
  • Temp Control: DSP Temp Controller with SCR Module
  • IR Heater: 2~2.5KW Halogen Lamp / 4ea /3Zone 
  • Plate Heater: Coated AL Plate Heater / 1~2KW / 1~2Zone
  • Special: Ramp up >60℃/sec (RT to  250℃ / 4sec)

Core™ IR Heating Inline System

Display - Glass Heating System

  • Application: Flexible Display
  • Substrate Size: Willow Glass 600mm x 0.1T
  • Heating: IR Heating, Convection Air
  • Transfer: Belt driven In-line Roller (Xfer Plane: 935mm)
  • Control Accuracy: Set temp ± 1℃
  • Temp Unifomity: Set temp <± 1℃ (3Point MIMO Control)
  • Temp Read: 3Point T/C
  • Power Control: 10H/W Zone (3S/W Zone) 

GYRO™ Glass Scribing System

Display - Glass Scribing System

  • Dimensions: (w)1700mm x (d)1900mm x (h)1640mm                                   + 1300mm x 1285mm x 1800mm 
  • Work Size: 1200mm x 1400mm x 1T(0.3~1T)                                            Straight Cut / R Cut (>0.2mm)

  • Stroke: X Axis (1250mm) / Y Axis (1450mm)  /                              Z Axis (100mm) / R Axis (360˚)         

  • Head Unit: Auto Pressure Regulation Wheel
  • Scribing Accuracy: ±0.02mm ↓
  • Work Table Flatness: ±0.05mm ↓
  • Size Control: CAD File Input
  • Speed: Straight 250mm/sec
  • PLC Touch Panel Control or PC Base Controller
  • Option: Vision Control / Air Blowing Cleaner

Core™ Spin COATER & HP

PLP - Spin Coater System

  • Dimensions: (w)2200mm x (d)1000mm x (h)2200mm 
  • Substrate Size: (w)200mm x (d)250mm

  • Appliction: Spin Coater & Hot Plate

  • Spin Speed: 0 ~ 5,000 RPM ± 5
  • Scan Arm: Multy Nozzle (Max 4 Nozzle) / Up, Down /                               Center to Edge Scan by Step Motor                     
  • Spin Chuck: Substrate chucking >-70kPa
  • Hot Plate Temp: RT ~ 200℃ / Set Temp ±1℃ /                                        Unifomity ±2℃
  • Micro Bubble Free: Vac. Degassing
  • Metering Dispensing: Max 50cc ± 0.05cc

Core™ Micro-Edge Dispenser

PLP- Micro Edge Dispenser

  • Dimensions: (w)1750mm x (d)1450mm x (h)2300mm  
  • Substrate Size: (w)415mm x (d)510mm x (t)1.2mm

  • Appliction: PLP Edge Coater

  • Stage Stroke & Velocity: X Axis (730mm, 300mm/sec) /                                        Y Axis (980mm, 300mm/sec) /                                        Z Axis (50mm, 300mm/sec)
  • Head Scanner: X Axis Line Width 10mm (1280Point) /                             Z Axis WD 56.5mm (Range ±8mm) /                               Resolution 1㎛
  • Head Vision Align: 15.93Ø (h)11.26mm x (v)11.26mm /                                Pixel 2048 x 2048 /                                                        Resolution 5.5㎛/pixel
  • Substrate Table: Panel Vac. Chuck /                                                        Align <0.1mm (Mechanical)
  • Align, Positioning, Line Accuracy: ±5 ㎛

Core™ Wafer Die Pick and Place

PLP - Wafer Die Transfer System

  • Application: 

Core™ Micro Pattern Dispenser

PLP - Micro Pattern Dispenser

  • Dimensions: (w)1370mm x (d)1460mm x (h)1690mm 
  • Substrate Size: 400mm x 400mm

  • Appliction: Flexible Display Pattern Printing

  • Stage Stroke & Velocity: X Axis (550mm, 300mm/sec) /                                          Y Axis (740mm, 300mm/sec) /                                          Z Axis (100mm, 300mm/sec)
  • Θ Axis: Stroke 5˚ / Resolution 0.00038˚
  • Vision Top: (h)960㎛ x (v)724.5㎛ / Pixel 1280 x 966                         Resolution 0.75㎛/pixel 
  • Vision Side: (h)1199㎛ x (v)914㎛ / Pixel 648 x 494                             Resolution 1.85㎛/pixel  
  • Vision Align: (h)234mm x (v)3.2mm㎛ / Pixel 1280 x 960                      Resolution 1.8㎛/pixel / Accuracy ±5㎛  
  • Laser 변위계: Range ±1mm / 분해능 0.04㎛ 이하
  • Align, Positioning, Line Accuracy: ±5 ㎛

CORE™ HPO System

Heating - HP Curing Oven

  • Dimensions: (w)1350mm x (d)1830mm x (h)2400mm                            3Slot Heating Chamber
  • Substrate Size: 415mm x 510mm Panel

  • Hot Plate: 580 x 680mm / 3Heating Chamber 

  • Process Temp & Control:  200℃ 

  • Temp Control Accuracy: Set Temp ± 1℃

  • Tem Unifomity: <± 3℃

  • Temp Read: K-Type T/C, 2~3 Zone (Inner, Center, Outer)
  • Temp Control: MIMO Control & Slot Selectable
  • Heating Elements: Micro Sheath, Inner 1.5Kw, Outer 2Kw

Core™ RTA System

RTA - Rapid Thermo Anneal

  • Dimensions: (w)1200mm x (d)1800mm x (h)1850mm
  • Substrate Size: 2″ / 4″ / 6″ / 8″ / 12″

  • Application: Compound Semiconductor (LED & LD Mfg)

  • Process Temp & Control: 300 ~ 1200℃
  • Temp Control Accuracy: Set Temp ± 1℃
  • Temp Unifomity: <± 3℃ / <± 2℃
  • Temp Read & Control: Pyrometer  
  • Power Control: H/W 8~24Zone, S/W Zone 3~7Zone
  • Substrate Support, Rotation: CVD SIC Susceptor / 30RPM
  • Process Pressure: ATM / RP
  • Leak Integrity: < 5mTorr/min

SiGe™ Epi System

Epi - Epitaxy System

  • Dimensions: (w)1200mm x (d)1800mm x (h)1850mm 
  • Substrate Size:  8″ / 12″

  • Application: Si/SiGe Blanket, Selective /                                               Doped Undoped Epi

  • Process Temp & Control: 200 ~ 1000℃ / 350 ~ 1100℃
  • Temp Control Accuracy: Set Temp ± 1℃
  • Temp Unifomity: <± 5℃ 
  • Temp Read & Control: Pyrometer  
  • Power Control: H/W 8~24Zone, S/W Zone 3~7Zone
  • Substrate Support, Rotation: CVD SIC Susceptor / 30RPM
  •  Process Pressure: ATM / RP
  •  Leak Integrity: < 5mTorr/min

CORONA™ 1200M System

Analysis - Heating Chamber

  • Application: Metal Analysis Process 8″ / 12″
  • Process Temp: 0 ~ 250℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp <± 5℃ / Soak <± 3℃
  • Temp Read: Non-Contact Pyrometer 4Point
  • Temp Control: Real Time 4 Point MIMO Control
  • Power Control: H/W 7 Zone / S/W 4 Zone 
  • Cold Heater Body Cooling 1/4″ In, Out
  • Wafer Lift: Non Contact With Susceptor
  • Chamber & Body Material: Teflon, Quartz
  • Chamber Dome (Option): Long Term Process

CORONA™ 1200MD System

Analysis - Heating Chamber

  • Application: Metal Analysis Process 8″ / 12″                                         Long Term Anneal (3Hours)
  • Process Temp: 0 ~ 250℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp <± 5℃ / Soak <± 3℃
  • Temp Read: Non-Contact Pyrometer 4Point
  • Temp Control: Real Time 4 Point MIMO Control
  • Power Control: H/W 7 Zone / S/W 4 Zone 
  • Cold Heater Body Cooling 1/4″ In, Out
  • Wafer Lift: Non Contact With Susceptor
  • Chamber & Body Material: Teflon, Quartz
  • Chamber Dome (Option): Long Term Process

CORONA™ 1200V System

Analysis - Heating Chamber

  • Dimension: (w)800mm x (d)1200mm x (h)1800mm
  • Application: Vacuum Organic Analysis Process 8″ / 12″          
  • Process Temp: RT ~ 400℃

  • Control Accuracy: Set temp ± 2℃

  • Control Unifomity: Set temp <± 5℃ 
  • Temp Read: Non-Contact Pyrometer 4Point
  • Temp Control: Real Time 4 Point MIMO Control
  • Power Control: H/W 7 Zone / S/W 4 Zone 
  • Substrate: Quartz Susceptor
  • Process Pressure: ATM / RP
  • Leak Intergrity: < 10mTorr/min

CORONA™ Table Heater

Analysis - Table Heater

  • Dimension: (w)320mm x (d)450mm x (h)430mm
  • Application: Wafer Anneal
  • Process Temp: RT ~ 250℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp ± 10℃
  • Temp Read: K-Type T/C
  • Cooling: Air Cooling
  • Bath Material: Quartz
  • Wafer Heating Area: Quartz &Teflon Mat

CHEM™ Inine Heater

Analysis - Chemical Heater

  • Dimension: (pai)80mm x (h)120mm
  • Application: Chemical Analysis 
  • Process Temp: RT ~ 200℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp ± 10℃
  • Temp Read: K-Type T/C

Core™ Lamp Heater System

WET - Wet Etch Heating System

  • Application: Wet Etch Single Process 
  • Process Temp: 0 ~ 230℃

  • Control Accuracy: Set temp ± 1℃

  • Tem Unifomity: Set temp <± 5℃ / Soak <± 3℃
  • Temp Read: Non-Contact Pyrometer /                                                 Chemical Temp On Silicon Surface          
  • Temp Control: Real Time 3Point MIMO Control /                                                3Pyrometer (Center, Middle, Edge)
  • Power Control: H/W 7Zone, S/W 3Zone 
  • Heater Colling: Cold Heater Body Cooling